DDR4

Features ECC: No Memory voltage: 1.3 V Memory voltage: 1.2 Product colour: Black Intel Extreme Memory Profile (XMP): Yes Memory clock speed: 3200 MHz Memory channels: Dual Cooling type: Heatsink Internal memory: 32 GB Buffered memory type: Unregister

Simple design to perfectly protect the cooling module High thermal conductive adhesive Supports Intel & AMD motherboards Selected high-quality IC Supports XMP2.0 Energy saving with ultra-low working voltage

Features Memory clock speed: 3200 MHz Lead plating: Gold Refresh row cycle time: 350 ns Row active time: 32 ns Memory form factor: 288-pin DIMM Programming power voltage (VPP): 2.5 V Memory layout (modules x size): 1 x 32 GB Row cycle time: 45.75 ns

Features Cooling type: Heatsink Memory form factor: 288-pin DIMM Intel Extreme Memory Profile (XMP): Yes Memory voltage: 1.35 V Internal memory type: DDR4 Component for: PC/Server Module configuration: 4096M x 64 Memory layout (modules x size): 1 x 3

Features Product colour: Black Memory voltage: 1.2 V Buffered memory type: Unregistered (unbuffered) CAS latency: 13 Memory form factor: 288-pin DIMM Intel Extreme Memory Profile (XMP): Yes Internal memory: 32 GB Memory layout (modules x size): 2 x 1

The Mushkin MRA4S320NNNF16GX2 is a kit of two 16 GB DDR4-3200 memory modules (PC4-25600) from the Redline series. The total capacity is 32 GB. The 260-pin unbuffered SO-DIMMs are suitable for a memory clock of up to 3200 MHz with a latency of 22-22-2

Features Compatible products: Intel 100 Series,Intel 200 Series,Intel 300 Series,Intel 400 Series,Intel 500 Series,Intel X299 Memory clock speed: 3200 MHz CAS latency: 16 SPD profile: Yes Cooling type: Heatsink Country of origin: Taiwan SPD latency:

Features Memory voltage: 1.2 V Memory form factor: 288-pin DIMM Memory clock speed: 2666 MHz Memory channels: Quad-channel Cooling type: Heatsink Country of origin: China Component for: PC/Server Internal memory type: DDR4 Internal memory: 32 GB CAS

Features Internal memory type: DDR4 Component for: PC/server Memory voltage: 1.2 V Buffered memory type: Unregistered (unbuffered) Memory channels: Single Memory clock speed: 2666 MHz ECC: No Memory layout (modules x size): 1 x 32 GB CAS latency: 19

Features Internal memory: 32 GB Memory layout (modules x size): 2 x 16 GB Lead plating: Gold Refresh row cycle time: 350 ns CAS latency: 16 Module configuration: 2048M x 64 Programming power voltage (VPP): 2.5 V Row cycle time: 45.75 ns Memory voltag

Features Intel Extreme Memory Profile (XMP): Yes CAS latency: 16 Row active time: 32 ns Row cycle time: 45.75 ns Memory form factor: 288-pin DIMM Refresh row cycle time: 350 ns Module configuration: 1024M x 64 Memory voltage: 1.35 V Cooling type: Hea