Goodram

Features Component for: PC/Laptop Random read (4KB): 110000 IOPS ECC: Yes SSD capacity: 512 GB Read speed: 3200 MB/s Random write (4KB): 250000 IOPS S.M.A.R.T. support: Yes Mean time between failures (MTBF): 1500000 h Interface: PCI Express 3.0 TBW r

Features NVMe: Yes Memory type: 3D NAND Mean time between failures (MTBF): 1500000 h TBW rating: 180 M.2 SSD size: 2280 (22 x 80 mm) Write speed: 2000 MB/s Interface: PCI Express 4.0 SSD capacity: 512 GB SSD form factor: M.2 Component for: PC/Laptop

Features On-Die ECC: No Buffered memory type: Unregistered (unbuffered) ECC: Yes Component for: PC/Server Internal memory: 8 GB Memory ranking: 1 Module configuration: 1024M x 72 Memory voltage: 1.2 V Chips organisation: 1Rx8 CAS latency: 19 Memory l

Features Interface: PCI Express 3.0 Write speed: 2700 MB/s SSD capacity: 1 TB S.M.A.R.T. support: Yes Mean time between failures (MTBF): 1500000 h Random read (4KB): 230000 IOPS NVMe: Yes TBW rating: 600 SSD form factor: M.2 Component for: PC/Laptop

Features Product colour: Black ECC: No Memory clock speed: 3200 MHz CAS latency: 16 Component for: PC/Server Memory channels: Dual-channel Memory form factor: 288-pin DIMM Cooling type: Heatsink Memory layout (modules x size): 2 x 8 GB Memory voltage

Features Internal memory type: DDR4 Memory form factor: 288-pin DIMM Component for: PC/server CAS latency: 19 Memory channels: Single Internal memory: 16 GB Buffered memory type: Unregistered (unbuffered) Memory clock speed: 2666 MHz ECC: No Memory v

Features Component for: PC/Laptop SSD capacity: 1 TB Memory type: 3D NAND Write speed: 2700 MB/s TBW rating: 360 SSD form factor: M.2 NVMe: Yes Read speed: 3600 MB/s Mean time between failures (MTBF): 1500000 h Interface: PCI Express 4.0 M.2 SSD size

Features Chips organisation: 2Rx8 Buffered memory type: Unregistered (unbuffered) Internal memory type: DDR4 Memory clock speed: 3200 MHz Memory form factor: UDIMM ECC Memory layout (modules x size): 1 x 16 GB Component for: PC/Server Internal memory

Features On-Die ECC: No Internal memory type: DDR4 Memory type: ECC Memory clock speed: 2666 MHz ECC: Yes Internal memory: 16 GB Memory form factor: UDIMM ECC CAS latency: 19 Module configuration: 1024M x 72 JEDEC standard: Yes Chips organisation: 2R

Features Internal memory type: DDR4 Component for: PC/server Memory voltage: 1.2 V Buffered memory type: Unregistered (unbuffered) Memory channels: Single Memory clock speed: 2666 MHz ECC: No Memory layout (modules x size): 1 x 32 GB CAS latency: 19

Features Module configuration: 2048M x 8 Internal memory: 32 GB CAS latency: 46 Memory layout (modules x size): 1 x 32 GB Memory clock speed: 5600 MHz Component for: Laptop Internal memory type: DDR5 Packaging data Package height: 10 mm Package width

Features CAS latency: 32 SPD profile: Yes Memory clock speed: 6400 MHz Cooling type: Heatsink ECC: No Intel Extreme Memory Profile (XMP) version: 3.0 Module configuration: 2048M x 8 AMD Extended Profiles for Overclocking (EXPO) version: 1.0 Internal