Goodram

Design Form factor: Cap Product colour: Black Operational conditions Storage temperature (T-T): -25 - 85 °C Operating temperature (T-T): 0 - 70 °C Packaging content Quantity per pack: 1 pc(s) Packaging data Package depth: 123 mm Package width: 103 mm

Features Internal memory type: DDR3 Component for: PC/server Product colour: Green Memory layout (modules x size): 1 x 4 GB Memory clock speed: 1600 MHz Internal memory: 4 GB Memory voltage: 1.35 V CAS latency: 11 Memory channels: Single Module confi

Features Internal memory type: DDR4 Component for: PC/server Memory form factor: 288-pin DIMM Internal memory: 4 GB CAS latency: 19 ECC: No Memory clock speed: 2666 MHz Memory layout (modules x size): 1 x 4 GB Buffered memory type: Unregistered (unbu

Features On-Die ECC: No Memory voltage: 1.35 V ECC: No Module configuration: 512M x 8 Component for: Laptop Product colour: Black Product colour: Green Internal memory type: DDR3 Memory clock speed: 1600 MHz Memory type: SODIMM Backlight: No Memory f

Features Product colour: Green Memory voltage: 1.2 V ECC: No Memory layout (modules x size): 1 x 4 GB Buffered memory type: Unregistered (unbuffered) Internal memory: 4 GB Memory clock speed: 2400 MHz CAS latency: 17 Internal memory type: DDR4 Compon

Features Memory layout (modules x size): 1 x 16 GB Internal memory type: DDR4 Memory clock speed: 2400 MHz Memory form factor: 288-pin DIMM CAS latency: 17 Component for: PC/Server Internal memory: 16 GB

Features Internal memory type: DDR4 Memory form factor: 288-pin DIMM Component for: PC/server CAS latency: 19 Memory channels: Single Internal memory: 16 GB Buffered memory type: Unregistered (unbuffered) Memory clock speed: 2666 MHz ECC: No Memory v

Features On-Die ECC: No Buffered memory type: Unregistered (unbuffered) ECC: Yes Component for: PC/Server Internal memory: 8 GB Memory ranking: 1 Module configuration: 1024M x 72 Memory voltage: 1.2 V Chips organisation: 1Rx8 CAS latency: 19 Memory l

Features Component for: PC/Laptop Random read (4KB): 110000 IOPS ECC: Yes SSD capacity: 512 GB Read speed: 3200 MB/s Random write (4KB): 250000 IOPS S.M.A.R.T. support: Yes Mean time between failures (MTBF): 1500000 h Interface: PCI Express 3.0 TBW r

Features On-Die ECC: No Internal memory type: DDR4 Memory type: ECC Memory clock speed: 2666 MHz ECC: Yes Internal memory: 16 GB Memory form factor: UDIMM ECC CAS latency: 19 Module configuration: 1024M x 72 JEDEC standard: Yes Chips organisation: 2R

Features Internal memory type: DDR4 Component for: PC/server Memory voltage: 1.2 V Buffered memory type: Unregistered (unbuffered) Memory channels: Single Memory clock speed: 2666 MHz ECC: No Memory layout (modules x size): 1 x 32 GB CAS latency: 19

Features Memory layout (modules x size): 2 x 16 GB Memory form factor: 288-pin DIMM Internal memory: 32 GB Memory clock speed: 2666 MHz Input voltage: 1.2 V Component for: Laptop Internal memory type: DDR4