Komponente

Tehnicki detalji: Broj modula: 2 komada Dimenzije: približno 141 x 8,5 x 43 mm (D x Š x V) Težina: 500g Materijal: aluminij, plastika srebro Osvjetljenje: RGB, 3-pinski RGB (5VDG, 5V) Konektor: 3-pin + 6-pin Kompatibi

Designed For 2nd Generation Intel® CoreTM Processors.Model name F3-10666CL9S-8GBXL Series RipjawsX Capacity 8 GB Module amount 1 piece placement two-sided memory chips data density 4096 each memory chip organisation 512Mx8 Design DIMM Type DDR3 Co

M/B Chipset - Intel P55/X38/X48/P4x, AMD 785/790/890 Series.CAS Latency - 9-9-9-24.Model name F3-12800CL9D-4GBNQ Series NQ Capacity 4 GB (2 x 2048 MB) Module amount 2 pieces Design DIMM Type DDR3 Connection 240-Pin Voltage by 1.5 Voltage until 1.6 Vo

XMP Ready for 1st, 2nd and 3rd Generation Intel Core Processors.Compatible with AMD platform.Model name F3-1600C11D-8GNT Series NT Capacity 8 GB (2 x 4096 MB) Module amount 2 pieces placement two-sided Design DIMM Type DDR3 Connection 240-Pin Voltag

Form factor: 2.5"data medium: not availableConnection Internal: SATA 6Gb/s (up to 9.5mm height)Connection external: USB 3.0 micro BRAID level: not availableFan(s): not availableDimensions: 135x85x16mmWeight: 78gColour: blackSpecial features: aluminiu

Low Voltage, High PerformanceRequired only 1.35V, the G.SKILL low voltage SO-DIMM memory kit consumes less power and generates less heat. It is the perfect memory solution to extend your laptop's battery life and enhance the stability due to lower te